US Patent Issued to Mitsubishi Materials on April 1 for "Pure copper material, insulating substrate, and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,264,390, issued on April 1, was assigned to Mitsubishi Materials Corp. (Tokyo).

"Pure copper material, insulating substrate, and electronic device" was invented by Yuki Ito (Kitamoto, Japan), Takumi Odaira (Kitamoto, Japan), Kenichiro Kawasaki (Kitamoto, Japan) and Kazunari Maki (Kitamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This pure copper material includes Cu in an amount of 99.96 mass % or more, either one or both of one or more A-group elements selected from Ca, Ba, Sr, Zr, Hf, Y, Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, and one or more B-group elements selected from O, S, Se, and Te are included in a tot...