US Patent Issued to Mitsubishi Materials Electronic Chemicals on Oct. 7 for "Metal coated resin particles, method for producing same, conductive paste containing metal coated resin particles, and conductive film" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,434,263, issued on Oct. 7, was assigned to Mitsubishi Materials Electronic Chemicals Co. Ltd. (Akita, Japan).

"Metal coated resin particles, method for producing same, conductive paste containing metal coated resin particles, and conductive film" was invented by Kensuke Kageyama (Akita, Japan), Kei Kinoshita (Akita, Japan) and Osamu Sakaya (Akita, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Metal coated resin particles include: spherical core resin particles; and a metal coated layer provided on a surface of each of the core resin particles, in which the metal coated layer consists of: a first silver layer formed on the surface of each of the co...