ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,018, issued on Nov. 25, was assigned to MITSUBISHI HEAVY INDUSTRIES LTD. (Toyko, Japan).
"Workpiece processing method and processing device" was invented by Takeshi Yamada (Tokyo), Akira Kono (Tokyo), Atsushi Sugai (Tokyo), Yu Matsunaga (Tokyo), Takeshi Hoshino (Tokyo), Shota Hosoi (Tokyo), Suguru Kondo (Tokyo) and Satoshi Kamata (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A workpiece processing method includes: a section roll forming step of subjecting a flat plate shaped workpiece to forming to impart a prescribed cross-sectional shape thereto; a solution heat treatment step of subjecting the workpiece, after the section roll forming ste...