US Patent Issued to MITSUBISHI HEAVY INDUSTRIES on Nov. 25 for "Substrate for power module and method of producing substrate for power module" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,758, issued on Nov. 25, was assigned to MITSUBISHI HEAVY INDUSTRIES LTD. (Tokyo).

"Substrate for power module and method of producing substrate for power module" was invented by Takashi Masuzawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate for a power module of the present disclosure includes: an insulation sheet; a plurality of front surface patterns formed on a front surface of the insulation sheet and disposed adjacent to each other with a gap between the plurality of front surface patterns in a direction in which the insulation sheet expands; a power semiconductor element connected to the front surface pattern; a plurality o...