ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,648, issued on March 25, was assigned to MITSUBISHI HEAVY INDUSTRIES LTD. (Tokyo).
"Laser processing device" was invented by Kazuhiro Yoshida (Tokyo), Yoshinao Komatsu (Tokyo), Saneyuki Goya (Tokyo), Akiko Inoue (Tokyo), Yasuyuki Fujiya (Tokyo), Ryuichi Narita (Tokyo) and Masahiko Shimizu (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "This laser processing device is provided with a laser radiating unit which forms a processed groove extending in a scanning direction on a workpiece, by subjecting the workpiece to laser processing while scanning the surface of the workpiece, and a nozzle portion which has a plurality of ejection holes arranged...