ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,100, issued on March 25, was assigned to MITSUBISHI HEAVY INDUSTRIES LTD. (Tokyo).
"Cooling device" was invented by Hiroki Matsuda (Tokyo) and Tsutomu Kawamizu (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling device that cools a semiconductor component mounted on a surface of a substrate includes a base attached to a back surface of the substrate, and a bottom plate disposed spaced apart from the base. A recessed part recessed toward the substrate side is formed in a region that is a surface, of the base, facing the bottom plate side and corresponds to the semiconductor component."
The patent was filed on June 1, 2022, under Applica...