ALEXANDRIA, Va., July 16 -- United States Patent no. 12,358,078, issued on July 15, was assigned to MITSUBISHI HEAVY INDUSTRIES LTD. (Tokyo).
"Laser machining device" was invented by Kazuhiro Yoshida (Tokyo), Yoshinao Komatsu (Tokyo), Saneyuki Goya (Tokyo), Akiko Inoue (Tokyo), Yasuyuki Fujiya (Tokyo), Ryuichi Narita (Tokyo), Masahiko Shimizu (Tokyo), Ryota Ozaki (Tokyo) and Yuki Kani (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A laser machining device includes: a laser irradiation unit that forms a machining groove that has one end opening to an end section of a workpiece and the other end thereof closed, as a result of scanning a workpiece surface from an end section of the workpiece and laser ma...