ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,510,347, issued on Dec. 30, was assigned to MITSUBISHI HEAVY INDUSTRIES LTD. (Tokyo).
"Scale thickness measuring method" was invented by Kentaro Jinno (Tokyo), Masaaki Kurokawa (Tokyo), Hajime Kumatani (Tokyo) and Yuji Kohashi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A measuring method of measuring a thickness of attachments attached to an outer peripheral surface of a heat transfer pipe by using an eddy-current probe, which is provided with an excitation coil and a pair of detection coils, the method including: obtaining a point in which the difference becomes zero is set as a reference point in a region to which the attachments is not att...