US Patent Issued to MITSUBISHI GAS CHEMICAL on June 24 for "Protective fluid for alumina, protection method, and production method for semiconductor substrate having alumina layer using same" (Japanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,338,381, issued on June 24, was assigned to MITSUBISHI GAS CHEMICAL COMPANY INC. (Chiyoda-ku, Japan).

"Protective fluid for alumina, protection method, and production method for semiconductor substrate having alumina layer using same" was invented by Toshiyuki Oie (Katsushika-ku, Japan), Priangga Perdana Putra (Katsushika-ku, Japan) and Akinobu Horita (Katsushika-ku, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention pertains to a protective fluid for alumina, a protection method, and a production method for semiconductor substrate having an alumina layer using same. This alumina protective fluid is characterized by: containing 0...