US Patent Issued to MITSUBISHI GAS CHEMICAL on Jan. 27 for "Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,559, issued on Jan. 27, was assigned to MITSUBISHI GAS CHEMICAL COMPANY INC. (Tokyo).

"Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device" was invented by Masashi Okaniwa (Tokyo), Kentaro Takano (Tokyo) and Tsuyoshi Kida (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain, a radical polymerizable resin or compound (B) other than the ...