ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,243, issued on Feb. 3, was assigned to MITSUBISHI GAS CHEMICAL COMPANY INC. (Tokyo).
"Resin, method for producing resin, curable resin composition, and cured product" was invented by Takuya Uotani (Tokyo), Yoichi Takano (Tokyo), Susumu Innan (Tokyo), Syouichi Itoh (Mie, Japan), Satoshi Yoshinaka (Tokyo), Mika Suzuki (Tokyo), Masashi Ogiwara (Okayama, Japan) and Hiroaki Oka (Okayama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "To provide a novel resin having excellent dielectric properties, a method for producing the resin, a curable resin composition, and a cured product. The resin contains constituent units described in Group (1). R1 each i...