ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,398,230, issued on Aug. 26, was assigned to MITSUBISHI GAS CHEMICAL COMPANY INC. (Tokyo).
"Curing resin composition, curing method therefor, and molded article" was invented by Noriyoshi Ogawa (Ibaraki, Japan) and Shun Ishikawa (Ibaraki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a curable resin composition which can be molded by casting to obtain composite materials each composed of a polycarbonate resin and an acrylic resin and having high transparency and high impact strength. More specifically, provided is a curing resin composition comprising an acrylic monomer having a saturated group, a polycarbonate resin having an unsatura...