US Patent Issued to Mitsubishi Electric on Sept. 9 for "Power semiconductor module, power conversion apparatus, and moving body" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,816, issued on Sept. 9, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Power semiconductor module, power conversion apparatus, and moving body" was invented by Ryo Tsuda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An insulated substrate (2) includes first and second circuit patterns (5,4). A semiconductor device (7) includes first and second main electrodes (9,8) connected to the first and second circuit patterns (5,4) respectively and through which main currents flow. A first lead (12) is solder jointed to the first circuit pattern (5). A second lead (11) is ultrasonic jointed to the second circuit pattern (4)."

The patent was file...