US Patent Issued to MITSUBISHI ELECTRIC on Sept. 9 for "Metal jointed body, semiconductor device, wave guide tube, and method for joining members to be joined" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,861, issued on Sept. 9, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo).

"Metal jointed body, semiconductor device, wave guide tube, and method for joining members to be joined" was invented by Takashi Ijima (Tokyo) and Koji Yamazaki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a metal jointed body, joined by solid-phase joining in the atmosphere, in which no protrusion of molten joining material occurs, that improves dimensional stability. A metal jointed body is formed by (A) making Ag films of two metal laminated bodies opposed to each other, the metal jointed body being configured by sequentially laminating a Zn film and ...