ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,413, issued on Sept. 30, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor package and semiconductor device" was invented by Masafumi Jochi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a semiconductor chip; a plurality of terminals connected to the semiconductor chip; and insulating sealing resin sealing the semiconductor chip and parts of the plurality of terminals, wherein an upper surface of the sealing resin is a flat heat radiation surface, the plurality of terminals respectively protrude from first and second side surfaces of the sealing resin that oppose each other, a distal end port...