US Patent Issued to Mitsubishi Electric on Sept. 23 for "Semiconductor device and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,500, issued on Sept. 23, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device and method for manufacturing semiconductor device" was invented by Katsuhiko Kondo (Tokyo) and Taishi Sasaki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device according to the first disclosure includes a base plate that has an upper surface and a back surface on a side opposite the upper surface and at the back surface of which an annular groove is formed, a substrate provided on the upper surface of the base plate and a semiconductor chip provided on an upper surface of the substrate, wherein the base plate has a convex warp...