US Patent Issued to Mitsubishi Electric on Oct. 7 for "Semiconductor device and method for manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,070, issued on Oct. 7, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device and method for manufacturing semiconductor device" was invented by Koichi Tanaka (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to the present disclosure, a semiconductor device comprises an insulating substrate having a wiring pattern in a surface layer thereof and a terminal electrode having a bag-shaped internal space with a terminal electrode tip aperture. The terminal electrode is grounded in a freestanding state by mating with the wiring pattern."

The patent was filed on Nov. 23, 2022, under Application No. 18/058,436.

*For further...