US Patent Issued to Mitsubishi Electric on Oct. 28 for "Semiconductor device and manufacturing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,666, issued on Oct. 28, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device and manufacturing method therefor" was invented by Kazuki Arata (Tokyo), Ryuichi Ishii (Tokyo) and Hiroshi Gokan (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "This semiconductor device includes a first dummy terminal extending from a second conductor toward one side in a first direction, a second dummy terminal extending from a fourth conductor toward another side in the first direction, and a third dummy terminal extending from a third conductor through between a third conductive plate and a fourth conductive plate toward one side in a second di...