US Patent Issued to Mitsubishi Electric on Oct. 28 for "Resin-sealed semiconductor device and method for manufacturing resin-sealed semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,665, issued on Oct. 28, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Resin-sealed semiconductor device and method for manufacturing resin-sealed semiconductor device" was invented by Ryuichi Ishii (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a resin-sealed semiconductor device that can regulate the thickness of a joining material joining a semiconductor element and a lead frame and inhibit the joining material from leaking out of a proper range. The resin-sealed semiconductor device includes a second lead frame joined via a second joining material above a semiconductor element joined above a heat spreader. The second lead...