ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,107, issued on Nov. 4, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor package" was invented by Hideo Komo (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat spreader (3) is provided on an upper surface of a cooling plate (1) with an insulating layer (2) interposed therebetween. A semiconductor chip (4) is provided on the heat spreader (3). Mold resin (10) seals the upper surface of the cooling plate (1), the heat spreader (3), and the semiconductor chip (4). The insulating layer (2) does not protrude from the heat spreader (3) to a side of the heat spreader (3). A groove (11) is provided on the upper surface of the coolin...