ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,147, issued on Nov. 4, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device and method for manufacturing semiconductor device" was invented by Yoshihiro Tsukahara (Tokyo) and Makoto Kimura (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a multi-layer board which a wiring pattern and a grounding pattern are formed. A plurality of semiconductor elements are mounted on the multi-layer board. An insulating sealing member is provided on the multi-layer board and is covering the plurality of semiconductor elements. A metal film is provided on the insulating sealing member. An in-groove metal is prov...