US Patent Issued to Mitsubishi Electric on Nov. 25 for "Gas heating apparatus, semiconductor manufacturing apparatus, heating element, and semiconductor manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,672, issued on Nov. 25, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Gas heating apparatus, semiconductor manufacturing apparatus, heating element, and semiconductor manufacturing method" was invented by Hiroshi Tanaka (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A gas heating apparatus includes a heating element having a flat plate shape, a heat-resistant enclosure in which a space having a flat plate shape is provided, the heating element being disposed in the space with a gap provided between the heating element and the heat-resistant enclosure, a gas inlet joint connected to the heat-resistant enclosure to allow gas to flow into ...