US Patent Issued to MITSUBISHI ELECTRIC on Nov. 18 for "Semiconductor device having a plurality of pillars and method of manufacturing the semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,789, issued on Nov. 18, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo).

"Semiconductor device having a plurality of pillars and method of manufacturing the semiconductor device" was invented by Yoichiro Tarui (Tokyo), Nobuo Fujiwara (Tokyo) and Takanori Tanaka (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates a semiconductor device using a super junction structure, and includes: a semiconductor base body of a first conductivity type; a pillar part including a plurality of first pillars of a first conductivity type and a plurality of second pillars of a second conductivity type provided on the semiconductor base ...