ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,159, issued on Nov. 18, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device" was invented by Shotaro Sakumoto (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to provide a technique for suppressing solder from peeling from a copper block. A copper block is bonded on a copper pattern via first solder and an electrode terminal is bonded on the copper block via second solder. The sealing resin covers the copper pattern, the first solder, the copper block, the second solder, the electrode terminal, and the semiconductor element. The area of the portion of the copper block bonded by the first solder is greater than ...