ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,694, issued on Nov. 18, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Circuit device" was invented by Yoshikazu Tsunoda (Tokyo), Takashi Kumagai (Tokyo), Tomohito Fukuda (Tokyo), Yuji Shirakata (Tokyo) and Kenta Fujii (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit device includes: a first heat sink having a first upper surface; a plurality of first partition plates and second partition plates attached to the first upper surface; a sealing material; a first circuit component; and a printed wiring board. A normal direction of the first upper surface is along a first direction. The first partition plates extend in a second direct...