ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,722, issued on Nov. 11, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor manufacturing apparatus" was invented by Masaki Ueno (Tokyo), Kinya Yamashita (Tokyo) and Yasushi Takaki (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to the present disclosure, a semiconductor manufacturing apparatus comprises a pickup stage having a mechanism for lifting and lowering a semiconductor chip having a square shape. The pickup stage comprises first pushing-up blocks at four corners. Each of the first pushing-up blocks comprises a first side parallel to one side of the semiconductor chip, a second side parallel to another side of t...