US Patent Issued to Mitsubishi Electric on Nov. 11 for "Power module including highly-heat-dissipating insulation adhesive sheet" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,761, issued on Nov. 11, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Power module including highly-heat-dissipating insulation adhesive sheet" was invented by Tomohisa Yamane (Tokyo), Kei Yamamoto (Tokyo), Kozo Harada (Tokyo), Masaki Taya (Tokyo), Yo Tanaka (Tokyo) and Kazuhiro Tada (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The power module includes: a heat spreader having a plate shape and having heat conducting property; a semiconductor element at least thermally connected to a one-side surface of the heat spreader; a highly-heat-dissipating insulation adhesive sheet having a plate shape and having a one-side surface thermally c...