US Patent Issued to Mitsubishi Electric on May 20 for "Semiconductor device manufacturing method and molding press machine" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,260, issued on May 20, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device manufacturing method and molding press machine" was invented by Kiyohiro Uchida (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A structural body is partially surrounded by a positioning plate, and a semiconductor element, a joining member, and a base plate around the joining member are exposed from the positioning plate, so that a positional relationship between the semiconductor element and the base plate is maintained. The joining member is heated by a heater while the semiconductor element, joining member, and base plate exposed from the positio...