ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,616, issued on May 13, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device and semiconductor module" was invented by Naoto Kaguchi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to provide a semiconductor device that implements cost reduction as well as determination of withstand voltage characteristics. A semiconductor substrate includes a semiconductor element on the front surface thereof and a back surface electrode on the back surface thereof that controls the operation of the semiconductor element. A first electrode and a second electrode are provided in a terminal region outside an active region in whic...