ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,637, issued on May 13, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor apparatus" was invented by Ko Kanaya (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device (100) according to the present disclosure comprises a semiconductor chip (130) in which are formed a protruding terminal (14) that electrically connects to a transistor (13) and that has a greater cross-sectional area than a bonding wire (4) and a short circuit prevention side wall (15) that is insulating and that covers side surfaces that face the surroundings of the protruding terminal (14). The semiconductor chip (130) is bonded to the upper surfa...