US Patent Issued to Mitsubishi Electric on March 4 for "Semiconductor device, semiconductor system, moving body, and method for manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,789, issued on March 4, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device, semiconductor system, moving body, and method for manufacturing semiconductor device" was invented by Naoki Yoshimatsu (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a laminated body, a semiconductor element, and a cooler. The laminated body includes a first conductor layer, a first insulator layer, a second conductor layer, a second insulator layer, and a third conductor layer. The first conductor layer, the first insulator layer, the second conductor layer, the second insulator layer and the third conductor layer...