US Patent Issued to Mitsubishi Electric on March 18 for "Semiconductor manufacturing apparatus and method of manufacturing semiconductor device using the same, and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,080, issued on March 18, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor manufacturing apparatus and method of manufacturing semiconductor device using the same, and semiconductor device" was invented by Takamasa Iwai (Tokyo), Yuichiro Suzuki (Tokyo), Akitoshi Shirao (Tokyo), Akira Kosugi (Tokyo) and Junji Fujino (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A mold die includes a resin injection gate through which fluid resin serving as mold resin is injected toward a cavity, a resin reservoir to store the fluid resin flowing through the cavity, and a resin reservoir gate. The resin reservoir is provided on the side opposi...