ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,078, issued on June 24, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device" was invented by Naoki Yoshimatsu (Tokyo) and Shintaro Araki (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device according to the present invention includes a cooler, a semiconductor package provided on an upper surface of the cooler, a metal plate having a main section provided on an upper surface of the semiconductor package, a spring that is provided above the main section and presses the main section toward the upper surface of the semiconductor package with an elastic force and a fixture that fixes the spring to an upper sur...