US Patent Issued to Mitsubishi Electric on June 17 for "Thin sheet-like connecting member and manufacturing method therefor, semiconductor device and manufacturing method therefor, and power conversion device" (Japanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,330,212, issued on June 17, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Thin sheet-like connecting member and manufacturing method therefor, semiconductor device and manufacturing method therefor, and power conversion device" was invented by Issei Otani (Tokyo), Hiroaki Tatsumi (Tokyo) and Jumpei Sawada (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a thin sheet-like bonding member, including applying a paste including first particles including a first metal, second particles including a second metal having a lower melting point than the first metal, and a solvent to a surface of a base material made of a substa...