ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,407, issued on June 17, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device and method of manufacturing semiconductor device" was invented by Takuya Shiratsuru (Tokyo), Shoji Saito (Tokyo) and Katsuhiko Kondo (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a semiconductor device, a frame includes a first frame portion extending in a direction parallel to a connection surface to be connected to the connection surface and a second frame portion connecting a case and the first frame portion. The first frame portions are divided into a plurality of divided portions. At least one divided portion in the plurality of divided p...