ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,605, issued on July 29, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device" was invented by Shogo Tokumaru (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor device in which adherence of solder balls to an insulating circuit board and an insulating layer is prevented. The semiconductor device includes a base plate, the insulating circuit board, and particulate matter. The insulating circuit board includes an upper surface holding a semiconductor element, and a lower surface bonded to a front surface of the base plate via a bonding material. The particulate matter adheres to the...