US Patent Issued to MITSUBISHI ELECTRIC on July 29 for "Semiconductor device, and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,649, issued on July 29, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo).

"Semiconductor device, and method of manufacturing semiconductor device" was invented by Koji Yamazaki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a semiconductor device according to the present disclosure, one end and the other end of a plurality of insulation covering wires are joined to a connection region in an upper electrode of a DBC substrate over a semiconductor element while an insulation covering portion in a center region has contact with a surface of the semiconductor element. The plurality of insulation covering wires are provided along an X directio...