ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,292, issued on July 15, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device" was invented by Daisuke Kawabata (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Object is to reduce the number of paths through which moisture enters in a semiconductor device. A semiconductor device includes a semiconductor element, a case housing the semiconductor element, a sealing material filled in the case, a low moisture permeable sheet covering the sealing material, and a lid covering an opening of the case. The low moisture permeable sheet is made of a low moisture permeable material having moisture permeability of 1 g/m2x24 Hr or less. ...