US Patent Issued to Mitsubishi Electric on July 1 for "Semiconductor device comprising a resin member having a rib including a lower end located below lower ends of a plurality of pin fins and semiconductor device manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,741, issued on July 1, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device comprising a resin member having a rib including a lower end located below lower ends of a plurality of pin fins and semiconductor device manufacturing method" was invented by Nobuyoshi Kimoto (Fukuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "It is an object to provide technology enabling suppression of contact deformation of pin fins during assembly of a semiconductor device and the like. A semiconductor device includes a base plate, a semiconductor element, and a resin member. The base plate has a plurality of pin fins on a lower surface the...