ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,006, issued on July 1, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device and method for manufacturing semiconductor device" was invented by Motoshi Kitagawa (Tokyo) and Kazumasa Kishimoto (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A laminate (22) is formed on a semiconductor substrate (10). Two or more grooves (54) are formed in the laminate (22). A mesa (24) with two grooves among the two or more grooves (54) positioned on both sides is formed. An insulating resin film (30) is embedded into the two or more grooves (54). A first opening (32) is formed at the insulating resin film (30) embedded in one of the two or mo...