US Patent Issued to Mitsubishi Electric on Jan. 28 for "Semiconductor device and method of manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,764, issued on Jan. 28, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device and method of manufacturing the same" was invented by Ken Sakamoto (Tokyo) and Keitaro Ichikawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The third side surface includes inclined surfaces inclined in a direction in which a center in an up-down direction of the third side surface is convex. The mold resin further includes a residual section provided in the center of the third side surface and a dowel section provided between the inclined surface and the residual section. The dowel section projects further in a lateral direction than the inclin...