US Patent Issued to Mitsubishi Electric on Jan. 27 for "Semiconductor device comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin, semiconductor device group comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin, and power conversion apparatus comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,811, issued on Jan. 27, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin, semiconductor device group comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin, and power conversion apparatus comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin" was invented by Taketoshi Shikano (Tokyo), Kotaro Nishihara (Tokyo), Kiyoshi Arai (Tokyo) and Shinya Soneda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Even if there is a change in the shape of a tr...