US Patent Issued to MITSUBISHI ELECTRIC on Jan. 20 for "Thermally improved PCB for semiconductor power die connected by via technique and assembly using such PCB" (French Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,416, issued on Jan. 20, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo).

"Thermally improved PCB for semiconductor power die connected by via technique and assembly using such PCB" was invented by Remi Perrin (Rennes, France) and Julio Brandelero (Rennes, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "Power module comprising a power semiconductor die and at least one substrate comprising an insulating layer in contact with a metallized connection surface of said die and at least one conductive path on a conductive layer on a face of the insulating layer opposite to the metallized connection surface of the die and wherein said insulating lay...