US Patent Issued to Mitsubishi Electric on Jan. 20 for "Semiconductor device and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,751, issued on Jan. 20, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device and method of manufacturing semiconductor device" was invented by Taichi Obara (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to provide a technique that improves the moisture uptake resistance of a semiconductor device. A semiconductor device includes a resin insulating sheet, a heat spreader provided on the resin insulating sheet, a semiconductor element mounted on the heat spreader, a lead frame having one end portion thereof connected to the semiconductor element, a first resin body that seals the resin insulating sheet, the heat ...