US Patent Issued to Mitsubishi Electric on Jan. 13 for "Semiconductor device with MMIC and pads reducing wire length" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,554, issued on Jan. 13, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device with MMIC and pads reducing wire length" was invented by Shin Chaki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: an MMIC having a DC pad; a bias substrate; a plurality of MIM capacitors mounted on the bias substrate; a plurality of pads provided on the bias substrate and respectively connected to overlying electrodes of the MIM capacitors; and a wire connecting the DC pad to any one of the plurality of pads, wherein the plurality of pads are arranged between the DC pad and the plurality of MIM capacitors in a pla...