ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,493, issued on Jan. 13, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device" was invented by Yasuhiro Sakai (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device in which a bonding state between a bonding object and a terminal is improved. The semiconductor device includes a bonding object, a case, and a terminal. The bonding object includes a metal pattern. The case includes a frame body and accommodates the bonding object inside the frame body. The terminal includes a first end and a second end. The first end is bonded to the metal pattern of the bonding object. The second end is led out of t...