US Patent Issued to Mitsubishi Electric on Feb. 10 for "Semiconductor device comprising a heat dissipation plate including a thick portion and a thin portion" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,728, issued on Feb. 10, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device comprising a heat dissipation plate including a thick portion and a thin portion" was invented by Tetsujiro Tsunoda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to provide a technique capable of enhancing the heat dissipation characteristics of a semiconductor device. The semiconductor device includes a heat dissipation plate, a layer member connected to the heat dissipation plate, a first semiconductor element, and a second semiconductor element. The first semiconductor element and the second semiconductor element are connected to ...