ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,394, issued on Dec. 30, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo).
"Semiconductor device and power converter" was invented by Hodaka Rokubuichi (Tokyo), Kei Yamamoto (Tokyo) and Ken Sakamoto (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a semiconductor element, a first lead frame, a second lead frame, and a thermally conductive member; and a sealing member sealing them. The first lead frame includes: a first portion exposed from a first side surface of the sealing member; and a second portion located closer to a lower surface of the sealing member than the first portion in a second direction crossing ...