US Patent Issued to Mitsubishi Electric on Dec. 30 for "Semiconductor device and method for manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,438, issued on Dec. 30, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device and method for manufacturing the same" was invented by Hideki Yamaguchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device capable of securing an insulation distance between a semiconductor element and a wiring. The semiconductor device includes a first semiconductor element, a second semiconductor element, a first wiring, and a second wiring. The first semiconductor element includes a first main surface and a second main surface. An electrode is formed on the first main surface. The second semiconductor element is disposed at a...