ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,398,958, issued on Aug. 26, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Cooling device" was invented by Yukio Nakashima (Tokyo) and Hiroyuki Ushifusa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling device includes a heat-receiving block on which a heat emitter is mounted, a first heat pipe fixed at the heat-receiving block, and a second heat pipe located adjacent to the first heat pipe. The first heat pipe accommodates a first refrigerant in the gas-liquid two-phase state, and the second heat pipe accommodates a second refrigerant in the gas-liquid two-phase state. The ratio of the amount of the second refrigerant in the liquid s...